Our findings conclude that the soldering material used in the manufacturing of the aluminum radiator has a potential to react with the chemical composition of the cooling fluid.
Over time, this may lead to sediment build-up which can be caught in the fins of the CPU block and cause an increase in temperatures as a result of the blockage. Ultimately, if the blockage builds up further, it could affect the function of the pump and impede the water flow to a point where computer failsafe mechanisms are triggered, possibly throttling CPU performance, or causing a system shutdown.